红外回流焊机已取代了以前由汽相回流焊所控制的大部分市场。产生这种变化的原因何在?Janet Page Walton进行了调查。当发现普通的波峰焊接机不适合于焊接带有表面安装元件的基板后(波峰易于在芯片背后留下间隙或在元件间产生桥接),对其它的焊接方法进行了试验,从中我们了解到最好的方法是红外焊接和汽相焊接。即将预先涂有焊膏的基板在红外或汽相中回流焊。红外焊接是将PCB组件由光源或辐射源加热的区域进行回 Infrared reflow machines have replaced most of the previous market controlled by vapor phase reflow. What is causing this change? Janet Page Walton conducted a survey. After finding that conventional wave soldering machines are not suitable for soldering substrates with surface mount components (crests tend to leave a gap behind the chip or create bridging between the components), other soldering methods were tested, from which we learned Good methods are infrared and vapor phase welding. The substrate pre-coated with solder paste is reflowed in the infrared or vapor phase. Infrared welding is to PCB components by the light source or radiation source heating area back