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采用有限元分析方法研究了碲镉汞红外焦平面器件在低温下由于不同热膨胀系数引起的热失配应力,提出了两种焦平面器件结构,可以有效地降低热应力,并应用于实际器件的制备,明显提高了碲镉汞焦平面器件的可靠性.
The finite element method was used to study the thermal mismatch stress of HgCdTe infrared focal plane devices due to different thermal expansion coefficients at low temperature. Two kinds of focal plane device structures were proposed, which can effectively reduce the thermal stress and apply them to practical devices Preparation, significantly improved the HgCdTeCFP device reliability.