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在HCO_3~-浓度为0.08 mol/L及不同浓度配比的SO_4~(2-)和Cl~-混合溶液中,利用循环极化电化学测试方法和SEM,对Cu工作电极的循环极化行为和点蚀表面形貌进行了系统的研究.结果表明,SO_4~(2-)或Cl~-均能促进Cu的阳极溶解,且二者间存在交互作用.Cl~-能降低Cu电极的腐蚀电位,增强其电化学活性.在点蚀敏感区域图中,Cu发生点蚀的临界Cl~-浓度为0.02 mol/L.当Cl~-浓度较低时,SO_4~(2-)对点蚀敏感性无影响;当Cl~-浓度为中等时,SO_4~(2-)抑制点蚀;当Cl~-浓度较高时,SO_4~(2-)使Cu点蚀敏感性先升高后降低.无论SO_4~(2-)浓度的高低,Cl~-都能促进点蚀.在本研究体系中,Cu的点蚀敏感性强烈地受到Cl~-和SO_4~(2-)的影响.
In the mixed solution of SO_4 ~ (2-) and Cl ~ - with HCO_3 ~ -concentration of 0.08 mol / L and different concentrations, cyclic voltammetry and SEM were used to study the cyclic polarization behavior of Cu working electrode And pitting surface morphology were systematically studied.The results show that SO 4 2- or Cl 3 can promote the anodic dissolution of Cu with the interaction between the two.Cl ~ - can reduce the corrosion of Cu electrode Potential and enhance its electrochemical activity.In the plot of pitting corrosion sensitivity, the critical Cl ~ - concentration for Cu pitting is 0.02 mol / L. When the concentration of Cl ~ - is low, the effect of SO 4 2- on pitting corrosion SO_4 ~ (2-) suppresses pitting corrosion when Cl ~ - concentration is moderate, but pitting sensitivity of SO_4 ~ (2-) increases first and then decreases when Cl ~ - is higher Regardless of the concentration of SO 4 2-, Cl ~ - can promote pitting corrosion.In this system, the pitting sensitivity of Cu is strongly affected by Cl ~ - and SO 4 2-.