有的电子爱好者把电路板上的某部分或体积较小的电路板密封起来,不让水气、灰尘和异物进入影响电路的性能,而采用蜡或沥青作密封胶。其实蜡和沥青作包封材料缺点很多。目前通用的最佳软包封材料,大致有聚硫化物、聚氨基甲酸酯、有机硅和环氧树脂等四个体系。用这些材料封装就是所谓软封装。它不需要利用封装外壳来进行集成电路芯片的安装和保护,而是借助于有机材料的印制线路板或陶瓷金属化布线基片,将芯片直接安置在预定的位置上,并利用金属线将芯片各输出、输入端与印制线路或金属化布线 Some electronics enthusiasts sealed some parts of the circuit board or smaller circuit boards to prevent moisture, dust and foreign matter from affecting the performance of the circuit, using wax or bitumen as a sealant. In fact wax and asphalt for packaging materials, many shortcomings. Currently the best common soft encapsulation material, roughly polysulfide, polyurethane, silicone and epoxy four systems. Packaging with these materials is the so-called soft package. Instead of using the package housing for the mounting and protection of the integrated circuit chip, it does this by means of a printed circuit board made of organic material or a ceramic metallization wiring substrate, which directly positions the chip in a predetermined position and uses a metal wire The chip output, input and printed circuit or metal wiring