引言 集成电路气密封装是电路生产中最后一道关键性的工序,为了得到长寿命、高可靠性、特别是国防工程上使用的电路器件,必须进行金属气密封装,即要求电路封装后不漏气。我国因气密封装技术未及时解决,过去曾有不少电路产品,在存放和使用过程中,由于漏气而性能变化损坏,甚至影响使用这些器件的军工项目的进行。 Introduction IC hermetic packaging is the last critical step in circuit production. In order to obtain long life and high reliability, especially for the circuit components used in national defense engineering, metal hermetic packaging must be performed, that is, no leakage after circuit packaging is required gas. Our country because the hermetic packaging technology is not resolved in time, there have been many circuit products in the past, in the process of storage and use, due to leakage and performance changes damage, and even affect the use of these devices military projects.