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在1997年的低价电脑浪潮席卷之下,CPU群雄并起,In-tel的CPU市场霸主地位开始动摇,IDT以超低价位为主战策略,后又与AMD联手出击,率先推出3DNow！技术标准,这会是它抢占市场的隆中之策吗? 小巧简单的芯片线路设计 在IDT Winchip出现之前,CPU设计潮流是SuperScalar超容量架构,每颗CPU从线路设计上就尽可能挤下更多的电晶体,来设计更多的解码、执行更多的管线,如采用非循序执行（out of order execution）、寄存器动态命名等技术,无论是Intel的Pentium PRO、PentiumⅡ,或是AMD K6、Cyrix 6X86MX/MⅡ等,都是走向这样的设计趋势。
In 1997 under the tide of low-cost computers swept under the CPU and the crowd, In-tel CPU market dominance began to waver, IDT to ultra-low-cost strategy for the main battle, and then jointly attack with AMD, the first to launch 3DNow! Technical standards, this will be Longzhong it seize the market it? Small and simple chip line design Before the advent of IDT Winchip, CPU design trend is SuperScalar ultra-capacity architecture, each CPU from the circuit design as much as possible to squeeze even more More transistors to design more decode and execute more pipelines, such as out of order execution, register dynamic naming technology, whether Intel Pentium PRO, Pentium II, or AMD K6, Cyrix 6X86MX / M Ⅱ, etc., are moving toward such a design trend.