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采用热等静压(HIP)工艺,把包复在真空玻璃容器内的C/Al复合丝热压成致密的C/Al复合材料。用扫描电镜(SEM)观察到复合材料的低强度平断口和界面反应层。运用透射电镜(TEM)和X射线能谱仪(XES)观察和确定界面的形貌和成分,发现界面分成层状,界面层的TiB_2向两边扩散,而纤维和基体的成分则通过界面而互相扩散。另外,还用电子衍射技术(EDT)研究了界面的晶体结构,确定它的相组成为TiO_2、TiC、TiB_2、γ-Al_2O_3及Ti、B和C等。采用俄歇电子能谱(AES)分析了界面区的化学组分,并运用二次离子质量谱(STMS)确定出界面的化学组成,除发现Al_4C_3,与EDT的结果基本一致。
The hot isostatic pressing (HIP) process was used to hot compact the C / Al composite wire wrapped in a vacuum glass container into compact C / Al composites. The low intensity flat fracture and the interface reaction layer of the composite were observed by scanning electron microscopy (SEM). The morphology and composition of the interface were observed and confirmed by transmission electron microscopy (TEM) and X-ray energy dispersive spectroscopy (XES). It was found that the interface was divided into layers, TiB_2 in the interface layer diffused to both sides, while the fibers and matrix components interacted with each other through the interface diffusion. In addition, the crystal structure of the interface was also studied by electron diffraction (EDT), and its phase composition was determined as TiO 2, TiC, TiB 2, γ-Al 2 O 3 and Ti, B and C. The chemical composition of the interface region was analyzed by Auger electron spectroscopy (AES) and the chemical composition of the interface was determined by secondary ion mass spectrometry (STMS). Except for Al4C3, the results were basically the same as those of EDT.