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玻利维亚和西班牙研究了在铊(Ⅰ)盐存在下金氰化反应的多相动力学。研究发现铊(Ⅰ)盐可起加速反应的作用。在pH>11.5时,传统的氰化反应中金的溶解速率显著下降。铊的存在使最大pH值增至13.5以上。这些结果以及计得的活化,能(9.2kJ mol~(-1))和pH与搅拌速度对反应速率的影响揭示出一种可能的机理,即金的表面可能发生电化学反应。根据此机理,金的表面可分为两个区域,一个阳极,一个阴极,两极分别发生金的氧化和铊(Ⅰ)的还原。阴极表面也可细分为阳极和阴极亚表面,在此亚表面上发生铊沉积和氧还原。与常规金氰化作用比
Bolivia and Spain studied the multiphase kinetics of gold cyanide in the presence of thallium (I) salts. The study found thallium (Ⅰ) salt can play a role in accelerating the reaction. At pH> 11.5, the dissolution rate of gold in the conventional cyanidation decreases significantly. The presence of thallium increases the maximum pH above 13.5. These results, together with the calculated activation, energy (9.2 kJ mol -1), and the effect of pH and stirring speed on the reaction rate, reveal a possible mechanism by which electrochemical reactions may occur on the gold surface. According to this mechanism, the surface of gold can be divided into two regions, one anode, one cathode, oxidation of gold and reduction of thallium (I) at the two poles, respectively. The cathode surface can also be subdivided into anode and cathode sub-surfaces where thallium deposition and oxygen reduction occur. And conventional cyanide than the role