制造集成电路所用的半导体片子,是将晶锭按规定厚度切成薄片,再进行研磨、抛光而得到的。目前,最普遍采用的片子直径为2吋～3吋,片子厚度为0.3～0.4毫米,且要求平面度极好。一般对于直径为3吋的片子平面度大都为10～20微米,但经高温炉等处理后,平面度将进一步变坏。可是,要想以更高的分辨 Semiconductor chips used in the manufacture of integrated circuits are obtained by slicing an ingot at a predetermined thickness, followed by grinding and polishing. At present, the most commonly used film is 2 inches to 3 inches in diameter, the film thickness is 0.3 to 0.4 mm, and the flatness is excellent. Generally for 3-inch diameter film flatness mostly 10 to 20 microns, but by high-temperature furnace treatment, the flatness will be further worsened. However, to higher resolution