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总结了不同金属材料在低周疲劳过程中典型的晶界、孪晶界、相界和微电子互连界面的损伤开裂行为.纯Cu中疲劳裂纹萌生的难易顺序为:小角度晶界、驻留滑移带和大角度晶界.对于纯Cu与铜合金中退火孪晶界,是否萌生疲劳裂纹与合金成分有关,随合金元素的加入降低了层错能,退火孪晶界相对容易萌生疲劳裂纹.对于Cu-Ag二元合金,由于存在不同的晶界和相界面,是否萌生疲劳裂纹取决于界面两侧晶体的取向差,通常两侧取向差大的界面容易萌生疲劳裂纹.在微电子互连界面中,疲劳裂纹萌生位置与焊料成分和时效时间有关,对于Sn-Ag/Cu互连界面,疲劳裂纹通常沿焊料与界面化合物结合处萌生;对于Sn-Bi/Cu互连界面,随时效时间增加会出现明显的由于Bi元素偏聚造成的界面脆性.
The damage and cracking behavior of the typical interface of grain boundary, twin boundary, phase boundary and microelectronic interconnection during the low cycle fatigue are summarized.The order of fatigue crack initiation in pure Cu is as follows: small angle grain boundary, Residing in the slip band and the large-angle grain boundary.For the pure copper and copper alloys in the annealing twin boundaries, whether the initiation fatigue crack and the alloy composition, with the addition of alloying elements to reduce the stacking fault energy, annealing twin boundaries relatively easy to sprout Fatigue crack.For the Cu-Ag binary alloy, due to the existence of different grain boundaries and phase interface, whether the initiation fatigue crack depends on the crystal orientation of the interface on both sides of the poor, usually large difference between the two sides of the interface prone to fatigue crack initiation. In the electronic interconnection interface, the location of fatigue crack initiation is related to the composition of the solder and the aging time. For the Sn-Ag / Cu interconnection interface, the fatigue crack usually occurs along the interface between the solder and the interface compound. For the Sn-Bi / Cu interconnection interface, With the increase of aging time, obvious interface brittleness caused by segregation of Bi elements appears.