随着半导体技术的发展,摩尔定律接近失效的边缘。产业链上IC设计、晶圆制造、封装测试各个环节的难度不断加大,技术门槛也越来越高,资本投入越来越大。由单个企业覆盖整个产业链工艺的难度显著加大。半导体产业链向专业化、精细化分工发展是一个必然的大趋势。 With the development of semiconductor technology, Moore’s Law approaches the edge of failure. Industry chain IC design, wafer manufacturing, packaging and testing all aspects of the increasingly difficult, the technical threshold is also getting higher and higher, the capital investment is getting bigger and bigger. It is more and more difficult for a single enterprise to cover the entire industrial chain. The semiconductor industry chain to the professional, fine division of labor development is an inevitable trend.