论文部分内容阅读
在硫代硫酸盐－亚硫酸盐－铜氨络离子浸金体系中，加入３～４ｇ／Ｌ强化剂ＣＯＰＸ，可溶解金粒上附着的氧化物及硫化物钝化膜，提高浸金率１０％～３０％。本法可用于含铜难处理金精矿及ＣＧＡ载金聚团中金的解脱。
In the thiosulfate - sulfite - copper ammonia complex immersion gold system, adding 3 ~ 4g / L enhancer COPX can be dissolved gold particles attached to the oxide and sulfide passivation film to improve the gold rate of 10 % ~ 30%. The method can be used for copper containing refractory gold concentrate and CGA agglomeration gold in the liberation.