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研究了不同时效时间下Sn-0.7Cu及Sn-0.7Cu-0.05Ni钎焊接头界面IMC的生长行为和拉伸性能的演变规律。结果表明,Cu/Sn-0.7Cu/Cu和Cu/Sn-0.7Cu-0.05Ni/Cu接头的界面IMC层厚度均随时效时间的增加而增加,适量添加Ni颗粒可以有效抑制该层的长大趋势;两种接头的抗拉强度均随时效时间的增加呈下降趋势,断裂形式由焊后的韧性断裂转变为脆性断裂;对这两种接头进行对比发现,适量的Ni颗粒可以使钎焊接头在获得较高抗拉强度的同时仍保持较好的塑形性能。
The growth behavior and tensile properties of IMC at Sn-0.7Cu and Sn-0.7Cu-0.05Ni brazed joints under different aging time were studied. The results show that the thickness of IMC layer at Cu / Sn-0.7Cu / Cu and Cu / Sn-0.7Cu-0.05Ni / Cu joints increases with the aging time, and the addition of Ni particles can effectively inhibit the growth of this layer The tensile strength of the two kinds of joints both decreased with the increase of aging time, and the fracture form changed from ductile fracture after welding to brittle fracture. Comparing the two kinds of joints, it was found that the proper amount of Ni particles could make the brazed joints In obtaining higher tensile strength while still maintaining good shaping performance.