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概述了满足卫星转发器高精度总体安装的微波集成电路基片焊接装配措施和例行试验情况,该工艺采用焊接工艺固定微波集成电路基片,研制了适合本工艺所需的低温焊接热源及控制设备,分析了几种常用钎料的焊接性能并进行了优选和研制,获得了良好的效果。应用表明,此项新工艺提高了卫星转发器电参数约稳定性,将会在电子器件组装方面发挥作用。
The welding assembly and routine tests of the microwave integrated circuit substrate that meet the overall installation of high precision satellite transponder are summarized. The welding process is used to fix the microwave integrated circuit substrate and the low temperature welding heat source and control Equipment, analysis of the welding performance of several commonly used solder and the optimization and development, and achieved good results. Applications show that this new process improves the stability of the electrical parameters of the satellite transponder and will play a role in the electronics assembly.