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伴随着电子集成电路产业的迅猛发展,芯片封装仿真模拟等手段不断提升,越来越多的性能仿真分析技术正逐步渗透到芯片封装技术的制造过程,仿真技术在保证封装的各项可靠性及产品性能的同时,省去了大量的封装实验验证批次,大大缩短设计和制造周期。通过对一种SoC芯片封装的电、热及应力性能的多物理域设计仿真分析,介绍如何使用仿真分析方法对SoC芯片封装的性能进行研究。
Along with the rapid development of electronic integrated circuit industry, chip packaging simulation and other means continue to improve, more and more performance simulation analysis technology is gradually penetrating into the chip packaging technology manufacturing process, simulation technology to ensure the reliability of the package and Product performance at the same time, eliminating the need for a large number of packaging experimental verification batch, greatly reducing the design and manufacturing cycle. Through the simulation analysis of the multiphysics design of the electrical, thermal and stress performance of a SoC chip package, this paper introduces how to use the simulation analysis method to study the performance of the SoC chip package.