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采用N i箔做中间层在真空下对TC4和QA l10-3-1.5进行扩散连接,用冷场发射扫描电镜(JEOL JSM 6700F)对焊接接头进行金相和能谱分析,用X射线衍射进行相分析,并进行硬度试验和接头拉伸试验。结果表明,在连接温度870℃,连接压力10MPa,保温时间60 m in规范下,N i做中间层能够实现TC4和QA l10-3-1.5扩散连接,其抗拉强度达到325 MPa。扩散连接界面形成了不同的分层结构,由形成了N iTi相,(N iTi+N i3Ti)相和N i(Cu)固溶体构成的扩散反应层。
The intermediate layer of N i foil was used for diffusion bonding of TC4 and QA l10-3-1.5 in vacuum. The welded joints were metallurgically and EDS analyzed by cold field emission scanning electron microscopy (JEOL JSM 6700F) Analysis, and hardness test and tensile test joints. The results show that under the standard of 870 ℃, connection pressure 10MPa and holding time 60 mins, the intermediate layer of N i can achieve the diffusion connection of TC4 and QA l10-3-1.5 with the tensile strength of 325 MPa. Diffusion junction interface formed a different layered structure, formed by the N iTi phase, (N iTi + N i3Ti) phase and Ni (Cu) solid solution diffusion reaction layer composed of diffusion reaction layer.