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盛夏,随着空气温度的升高,PC 的体温也在创造新高。而过高的温度会妨碍系统的正常运行,甚至毁坏硬件。为此,许多用户常打开机箱以增强散热性能,但这样会加大辐射泄漏以至影响到健康。不仅如此,各种风扇的噪音使原本已酷热难耐的夏天更加无法忍受。用户的需求以及新PC 平台对散热提出更高的要求,促使Intel 推出了TAC1.1规范的“38度”机箱。但因TAC1.1并非强制标准,许多厂商利用了“38度”机箱的概念,使得机箱市场真假难辨。
Summer, with the air temperature, PC body temperature is also creating a new high. Too high a temperature can hinder the normal operation of the system and even destroy the hardware. To this end, many users often open the case to enhance the thermal performance, but this will increase the radiation leakage and even affect the health. Not only that, the noise of various fans makes the already extremely hot summer intolerable. The needs of users and the new PC platform put forward higher requirements for heat dissipation, prompting Intel to launch the TAC1.1 specification “38 degree” chassis. However, because TAC1.1 is not a mandatory standard, many manufacturers use the concept of “38 degree” chassis, making the chassis market difficult to distinguish true and false.