一、问题的提出国内自生产半导体器件以来,普遍存在引线可焊性差的问题。整机厂在装机使用之前,大多数都要预先刮去引线表面的涂镀层,然后重新沾锡再装机,浪费了大量的人力物力。据统计,组装一台12英寸的黑白电视机,引线刮脚和浸锡,平均耗时2.1时,比国外组装一台电视机的耗时还高。刮去引线表面镀层,重新沾锡,使耗锡量增加一倍。有的器件引线刮去的是黄金、白银,经济损失更大。由于引线二次处理,每台电视机平 First, the question raised Since the production of semiconductor devices in the country, the widespread problem of poor solderability lead. The whole plant before using the machine, most of the pre-scrape the lead surface coating, and then re-dip tin and then installed, wasting a lot of manpower and resources. According to statistics, the assembly of a 12-inch black and white TV, lead scratch feet and immersion tin, the average time-consuming 2.1, a time-consuming than the time-consuming assembly of a television set abroad. Scrape the lead surface coating, re-dip, so that consumption of tin doubled. Some devices lead scraping is gold, silver, greater economic losses. Due to lead secondary processing, each TV flat