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综述了无色透明耐高温聚酰亚胺(PI)膜材料的应用、国内外研究进展和分子结构设计方法。首先,介绍了PI膜材料在微电子及光电产业的应用,以及国内外对无色透明耐高温PI的研究现状。从分析PI有色原因及影响因素入手,阐述了目前制备无色透明PI膜材料的主要分子结构设计方法:引入含氟取代基、主链引入脂环结构、非共平面结构、间位取代二胺、引入砜基等。此外,在使PI无色透明化的同时,为了不牺牲PI优良的耐热性,与适量无机纳米组分复合也是一个可行的设计手段。
The application of colorless and transparent high temperature polyimide (PI) film materials, the research progress at home and abroad and the molecular structure design methods are summarized. First of all, the application of PI film in the microelectronics and optoelectronics industry, as well as the research status of colorless and transparent high temperature resistant PI at home and abroad are introduced. Based on the analysis of the causes and influencing factors of PI color, the main molecular structure design methods of preparing colorless and transparent PI film materials are described. The introduction of fluorine-containing substituents, introduction of alicyclic structure in the main chain, non-coplanar structure, , Introduction of sulfone and the like. In addition, while making the PI colorless and transparent, it is also a feasible design method to compound with an appropriate amount of inorganic nano-components in order not to sacrifice PI’s excellent heat resistance.