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晶圆加工中越来越广泛地采用可重构的自动化组合设备,其单晶圆加工技术提高了晶圆制造的生产效率和加工质量。介绍了组合设备的结构特征及其加工过程运行的约束条件,由于晶圆重入加工需求的增加,组合设备的调度变得更加复杂。回顾了组合设备可重入加工过程的建模、性能分析及其调度等研究工作,分析了重入加工的Petri网建模,调度和控制方法的优劣性,并通过例子阐述了仿真调度的可行性。提出了组合设备重入加工运行控制的研究方法及未来的研究方向。
More and more widely used in wafer processing reconfigurable automation combination of equipment, its single-wafer processing technology to improve wafer manufacturing production efficiency and processing quality. The structural characteristics of the combined equipment and its constraints on the operation of the process are introduced. The scheduling of the combined equipment becomes more complicated due to the increasing demand for reworking of the wafers. Reviewing the researches on modeling, performance analysis and scheduling of reusable machining of combined equipment, analyzed the advantages and disadvantages of Petri nets modeling, scheduling and control methods for re-processing, and illustrated the advantages and disadvantages of the simulation scheduling feasibility. Put forward the research methods and future research direction of combined equipment re-entry processing operation control.