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随着电子封装技术的飞速发展,由于原材料种类的不断增加和生产流程的不断扩展,污染物的控制变成了一个极具挑战性工作。电子封装中的外来物失效分析一直以来都是一项极具挑战性的工作。
With the rapid development of electronic packaging technology, the control of pollutants has become a very challenging job due to the increasing variety of raw materials and the continuous expansion of production processes. Foreign object failure analysis in electronic packaging has always been a challenging job.