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通过光学显微镜(OM)、X射线衍射分析仪(XRD)和扫描电子显微镜(SEM)研究Ti基Ti-Sn-Ag合金的微观组织结构,并对合金的抗腐蚀性能进行初步探究。实验结果显示,Ti基Ti-Sn-Ag合金中的Ag元素主要以游离态形式存在,而Ti和Sn元素可以形成Ti-Sn二元金属间化合物,并且Ti-Sn金属间化合物的结构类型由合金中Ti和Sn之间的原子比决定。当Ti与Sn的原子比为64:30时,合金中存在Ti_3n和Ti_2Sn两种金属间化合物;当Ti与Sn的原子比为69:16时,合金中只存在Ti_3Sn一种金属间化合物;当Ti与Sn的原子比为67:7时。Ti与Sn元素之间并不能形成金属问化合物,但有少量的Sn元素分别固溶于Ag和Ti基体中。研究结果显示Sn元素的添加能在一定程度上提高合金的抗腐蚀性能。
The microstructure of Ti-Sn-Ag alloy was studied by optical microscope (OM), X-ray diffraction (XRD) and scanning electron microscopy (SEM). The corrosion resistance of the alloy was also investigated. The experimental results show that the Ag element in the Ti-based Ti-Sn-Ag alloy mainly exists in the free state, while the Ti and Sn elements form the Ti-Sn binary intermetallic compound, and the Ti-Sn intermetallic compound is composed of the alloy The atomic ratio between Ti and Sn is determined. When the atomic ratio of Ti to Sn is 64:30, there are two kinds of intermetallic compounds Ti_3n and Ti_2Sn. When the atomic ratio of Ti and Sn is 69:16, there is only Ti_3Sn intermetallic compound in the alloy. The atomic ratio of Ti to Sn is 67: 7. Metallic compounds are not formed between Ti and Sn, but a small amount of Sn is dissolved in Ag and Ti respectively. The results show that the addition of Sn can improve the corrosion resistance of the alloy to a certain extent.