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采用纯粉末,通过SPS烧结制备了组织均匀、致密且体积分数高的SiC_p/Al电子封装材料．通过对SPS烧结现象的研究,认为该复合材料的SPS烧结过程属于反应性烧结,大部分收缩在极短时间内完成；另外对SiC体积分数和SiC颗粒尺寸对热导率、热膨胀系数的影响进行了研究,发现SiC体积分数越高,复合材料的热导率和热膨胀系数越低；SiC颗粒粒径增大,复合材料的热导率增高,而热膨胀系数减小．
Using pure powder, the SiC_p / Al electronic packaging material with uniform structure, compactness and high volume fraction was prepared by SPS sintering. Through SPS sintering phenomenon, it is considered that the SPS sintering process is reactive sintering, most of the shrinkage is completed in a very short period of time. In addition, the effect of SiC volume fraction and SiC particle size on thermal conductivity and thermal expansion coefficient It is found that the higher the volume fraction of SiC, the lower the thermal conductivity and thermal expansion coefficient of the composites. The larger the SiC particle size, the higher the thermal conductivity of the composites and the lower the thermal expansion coefficient.