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针对＂传感器中毒＂现象，在正面敏感的扩展电阻硅流量（ＳＲＳＦ）传感器的基础上，提出背面敏感的ＳＲＳＦ传感器，并设计出相应的表面贴装元件（ＳＭＣ）封装形式。理论推导和测试结果表明：背面敏感的ＳＲＳＦ传感器的输出电压与流体流速、流向的关系可表述为：；芯片厚度对灵敏度影响很大，其最佳值为１５０μｍ。在最佳厚度下，背面敏感方式虽然牺牲了ＳＲＳＦ传感器的１０％的灵敏度，但却能有效防止传感器中毒，ＳＭＣ封装形式使背面敏感ＳＲＳＦ传感器的正、反流向对称性大大改善。
Aiming at the “sensor poisoning” phenomenon, a SRSF sensor with backside sensitivity is proposed based on the front sensitive extended resistance silicon flow (SRSF) sensor and a corresponding surface mount component (SMC) package is designed. The theoretical derivation and test results show that the relationship between the output voltage of the back-sensitive SRSF sensor and the fluid flow velocity and flow direction can be expressed as: The thickness of the chip has a great influence on the sensitivity, and the optimal value is 150 μm. At the optimum thickness, the backside sensitive mode sacrifices 10% sensitivity of the SRSF sensor, but it can effectively prevent sensor poisoning. The SMC package greatly improves the positive and negative symmetry of the back-side sensitive SRSF sensor.