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采用机械共混及模压成型工艺将Al2O3粉体,含H20哑铃状液晶化合物(HLCP)与环氧树脂(E-51)共混制备了HLCP/EP/Al2O3复合材料。研究了Al2O3含量对材料热稳定性、导电性能、导热性能及热膨胀的影响。结果表明:材料的导热系数、介电常数及热稳定性随Al2O3含量的增加而增大,当Al2O3粉体质量分数达到70%时,材料导热系数是纯环氧树脂的1.7倍;介电损耗、线膨胀系数随Al2O3含量的增加而减小,当Al2O3粉体质量分数为60%时,介电常数为3.71。同时,由于HLCP网格的存在,降低了材料的内耗,提高了复合材料的玻璃化转变温度,增强了电性能。
The HLCP / EP / Al2O3 composites were prepared by blending Al 2 O 3 powder, HLCP with epoxy resin (E-51) by mechanical blending and molding. The effects of Al2O3 content on the thermal stability, electrical conductivity, thermal conductivity and thermal expansion were investigated. The results show that the thermal conductivity, dielectric constant and thermal stability increase with the increase of Al2O3 content. When the mass fraction of Al2O3 powder reaches 70%, the thermal conductivity of the material is 1.7 times that of pure epoxy resin. The dielectric loss , The linear expansion coefficient decreases with the increase of Al2O3 content, and the dielectric constant is 3.71 when the mass fraction of Al2O3 powder is 60%. At the same time, due to the presence of the HLCP grid, the internal friction of the material is reduced, the glass transition temperature of the composite material is increased, and the electrical performance is enhanced.