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随着光刻机分辨力的提高,其焦深日益缩小。针对如何充分利用有限的焦深完成Si片的高效曝光,对步进扫描光刻机和双工件台光刻机的调平调焦原理进行了介绍,主要包括基于双光栅的检焦测量原理及检焦扫描路径规划,把Si片表面高度信息转化为离焦量和倾斜量等调平数据的算法,以及曝光位置实现调平调焦的伺服控制系统等,并从理论上对两系统的优缺点进行了对比。最后利用一组调平实验结果说明了双工件台系统调平调焦技术的优越性,指明了调平调焦技术的发展方向。
With the improvement of resolution of lithography, the depth of focus is getting smaller and smaller. Aiming at how to make full use of the limited depth of focus to complete the high efficiency exposure of Si wafer, the principle of leveling and adjusting of the stepper scanning lithography machine and the duplex workpiece lithography machine is introduced. The principle of double focus measurement And focusing scanning path planning, the Si surface height information into the amount of defocus and tilt leveling data algorithm, as well as the exposure position to achieve leveling and leveling servo control system, etc., and theoretically on the two systems The pros and cons are compared. Finally, a series of leveling experiment results are used to illustrate the superiority of the dual workpiece stage system to adjust the focus and focus, and the direction of the development of the leveling and focusing technology is pointed out.