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The microstructures of copper liners of shaped charges prepared by electroforming technique were investigated by transmission electron microscopy (TEM). Meanwhile, the orientations distributing of the grains in the electroformed copper liners of shaped charges was examined by the electron backscattering Kikuchi pattern (EBSP) technique. TEM observations have revealed that these electroformed copper liners of shaped charges have the grain size of about 1-3 um and the grains have a preferential orientation distribution along the growth direction. EBSP analysis has demonstrated that the as-formed copper liners of shaped charges exhibit a micro-texture, i.e. one type of fiber texture, and the preferred growth direction is normal to the surface of the liners.
The microstructures of copper liners of shaped charges prepared by electroforming technique were investigated by transmission electron microscopy (TEM). Meanwhile, the orientations distributing of the grains in the electroformed copper liners of shaped charges was examined by the electron backscattering Kikuchi pattern (EBSP) technique TEM observations have been revealed that these electroformed copper liners of shaped charges have the grain size of about 1-3 um and the grains have a preferential orientation distribution along the growth direction. EBSP analysis has demonstrated that the as-formed copper liners of shaped charges exhibit a micro-texture, ie one type of fiber texture, and the preferred growth direction is normal to the surface of the liners.