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采用纳米压痕技术对微电子封装中无铅焊点内界面化合物(IMC)Cu_6Sn_5的弹性模量和硬度进行了测试。根据实际工业工艺流程和服役工况,制备接近真实服役状态下的微电子封装中无铅焊点界面化合物试样;采用扫描电镜(SEM)和能量色散X射线荧光光谱仪(EDX)确定IMC的形貌和化学成分;利用连续刚度测量(CSM)技术,采用不同的加载速率对无铅焊点(Sn3.0Ag0.5Cu、Sn0.7Cu和Sn3.5Ag)内的界面化合物Cu_6Sn_5进行测量,得到载荷、硬度和弹性模量-位移曲线。根据纳米压痕结果确定Cu_6Sn_5的蠕变应力指数。
The elastic modulus and hardness of the Cu_6Sn_5 intermetallic compound (IMC) in the lead-free solder microelectronics package were tested by nanoindentation technology. According to the actual industrial process and service conditions, the samples of the lead-free solder interface compounds in the microelectronic package near the real service state were prepared. The shape of the IMC was determined by scanning electron microscopy (SEM) and energy dispersive X-ray fluorescence spectrometer (EDX) Appearance and chemical composition of the lead-free solder joints were measured by using continuous stiffness measurement (CSM) technique. The interfacial compounds Cu_6Sn_5 in lead-free solder joints (Sn3.0Ag0.5Cu, Sn0.7Cu and Sn3.5Ag) were measured at different loading rates, Hardness and elastic modulus - displacement curve. The creep stress index of Cu_6Sn_5 was determined according to the results of nanoindentation.