日立制作所与千住金属工业日前成功开发出了耐热温度为260℃的Sn(锡)—Cu(铜)高温无铅焊锡,在260℃的高温条件下焊接强度为6Mpa,基本上和现有的高温Sn—Pb共晶焊锡相同,附着性也达到了不存在任何实用问题的水平。在欧洲将要实施的有害物限制法案——《RoHS法令》中,半导体内部使用的高温焊锡因为难以实现无铅化而不属于法令的 Hitachi and Thousands of Metal Industries recently successfully developed Sn (tin) -Cu (copper) high-temperature lead-free solder with a heat resistance temperature of 260 ° C and a welding strength of 6Mpa at a high temperature of 260 ° C, Of the same high-temperature Sn-Pb eutectic solder adhesion also reached the level of practical problems do not exist. Pesticide Restriction Act to Be Implemented in Europe - “RoHS Act”, high-temperature solders used inside semiconductors are not ordinances because it is difficult to achieve lead-free solder