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针对铜合金馈线波导器件工艺过程中出现的电镀发黑、镀层不牢等难题,进行了大量工艺试验及低温钎焊工艺的优化研究。结果表明,镀层发黑的主要原因为焊缝结合率不高、致密性不够,电镀过程中的清洗液残留所导致。通过试验,得到了优化的馈线零部件低温钎焊工艺,并对焊接结构进行了改进,使钎焊质量能够满足产品的尺寸精度、电镀要求。
Aiming at the problems of blackening of plating and unsharpening of plating during the process of copper alloy feeder waveguide device, a large number of process experiments and optimization of low temperature brazing process were carried out. The results show that the main reason for the blackening of the coating is that the weld joint rate is not high, the compactness is not enough, and the residue of the cleaning solution in the electroplating process is caused. Through the experiment, the optimized low temperature brazing process of feeder components is obtained, and the welding structure is improved so that the brazing quality can meet the dimensional accuracy and plating requirements of the product.