采用波长为532 nm的短脉冲激光(脉宽6 ns)对Y-TZP陶瓷进行铣削实验研究。探究了单次刻蚀槽宽与功率的关系,分析脉冲数与材料阈值的关系,确定材料阈值。并且探究了铣削量及质量随激光工艺参数的变化规律,确定最优工艺参数,进一步进行了脉冲激光铣削微米级二维结构的工艺实验。研究结果表明槽宽的平方与脉冲峰值功率的对数呈线性关系,根据此关系式计算得出光斑半径与实际测量值相符。材料阈值随脉冲数增加而降低,在扫描速度、功率和重复频率的最优匹配下,可实现最大铣削量为1.35 mm3/min。在优化工艺参数下,完成直径500μm的盲孔和宽200μm、高100μm的台阶方槽二维结构无裂纹铣削加工,结构边缘无残渣堆积,表面粗糙度为3.746μm。 Y-TZP ceramics were milled by using a short pulse laser with a wavelength of 532 nm (pulse width 6 ns). The relationship between the width of a single etching groove and the power was explored. The relationship between the number of pulses and the material threshold was analyzed to determine the material threshold. In addition, the variation law of the milling amount and quality with the laser process parameters was explored, the optimum process parameters were determined, and the pulsed laser milling process experiment of the micrometer two-dimensional structure was further carried out. The results show that the square of the groove width is linear with the logarithm of the pulse peak power, and the radius of the spot is calculated according to this relation to be consistent with the actual measured value. Material thresholds decrease with increasing pulse number, achieving a maximum milling amount of 1.35 mm3 / min with optimum matching of scan speed, power and repetition frequency. Under the optimal process parameters, blind holes with a diameter of 500 μm and two-dimensional structures with a width of 200 μm and a height of 100 μm are completed without crack milling, and the edge of the structure has no residue buildup. The surface roughness is 3.746 μm.