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研究Sn-0.75Cu焊料合金及其接头在NaCl-Na_2SO_4和NaCl-Na_2SO_4-Na_2CO_3模拟土壤溶液中的腐蚀与浸出行为,并与其在NaCl溶液中的行为进行对比,以评估废弃电子产品被填埋时对环境的潜在危害。Sn的浸出动力学表明,Sn的浸出量随时间的增加而增加。在NaCl溶液中接头的Sn浸出量是最多的。SO_4~(2-)和CO_3~(2-)阻碍了接头中Sn的浸出,但加速了焊料中Sn的浸出。在NaCl溶液中的接头表面腐蚀层疏松多孔,而在NaCl-Na_2SO_4和Na Cl-Na_2SO_4-Na_2CO_3溶液中的接头表面腐蚀层则较为致密。XRD结果表明,焊料和接头表面的腐蚀产物以Sn的氧化物、氯化物和碱式氯化物为主。讨论了焊料合金在模拟土壤溶液中的动电位极化曲线。
The corrosion and leaching behaviors of Sn-0.75Cu solder alloy and its joints in simulated soil solutions of NaCl-Na_2SO_4 and NaCl-Na_2SO_4-Na_2CO_3 were studied and compared with their behavior in NaCl solution to evaluate when the waste electronic products were buried Potential damage to the environment. Leaching kinetics of Sn showed that Sn leaching increased with time. The amount of Sn leached by the linker in NaCl solution was the largest. SO_4 ~ (2-) and CO_3 ~ (2-) impeded the Sn leaching in the joints, but accelerated the Sn leaching in the solder. In the NaCl solution, the corrosion layer of the joint surface is loose and porous, while the surface corrosion layer of the joint in NaCl-Na_2SO_4 and NaCl-Na_2SO_4-Na_2CO_3 solution is relatively dense. The XRD results show that the corrosion products of the solder and the joint surface are mainly composed of Sn oxides, chlorides and basic chlorides. The potentiodynamic polarization curve of solder alloy in simulated soil solution is discussed.