一、概述八三年十月,电子工业部与中国电子学会在上海联合召开了元器件引线可焊性技术交流会。会上,国营七四六厂代表熊尚林同志宣读了《锡铈可焊性电镀技术》的报告。报告中所介绍的该工艺技术的高可焊性,引起了与会代表的广泛关注和兴趣。继而,在全国元器件厂掀起了锡铈可焊性电镀工艺的验证热。但是,由于各种原因,进行验证的大多数厂均未获得满意的结果,一度时期,对这项工艺的评价褒贬不一。八四年初,南京第二晶体管厂组织力量全面攻关,以推动南京地区可焊性工作的开展。在攻关过程中,坚持运用全面质量管理的思想和方法,首先采用四因素三水平正交试验法摸索出 I. Overview October 2003, the Ministry of Electronics Industry and the China Institute of Electronics jointly held in Shanghai solderability lead wire technology exchange. At the meeting, Comrade Xiong Shanglin, chairman of state-owned No.744 Factory, read the report titled “Tin-Cerium Solderable Electroplating Technology”. The high solderability of the process described in the report aroused the widespread concern and interest of the delegates. Subsequently, the national component factory set off a cerium solderability plating process verification heat. However, due to various reasons, most of the plants that have been verified failed to achieve satisfactory results. For a time, the evaluation of this process was mixed. At the beginning of 1984, the second transistor plant in Nanjing organized an overall effort to promote the solderability work in Nanjing. In the process of tackling the problem, insist on using the ideas and methods of total quality management, first of all, using four factors and three levels of orthogonal test method to explore