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利用粉末注射成型技术对金刚石/铜基钎料粉末进行了注射成型实验,制备出了小型金刚石制品。采用溶剂–热脱脂二步脱脂工艺对金刚石制品进行脱脂处理。分析了溶剂脱脂过程中脱脂温度及脱脂时间对脱脂率的影响规律;利用扫描电子显微镜观测了不同溶剂脱脂时间下微观孔隙形成情况;考察了分别在H2和N2气氛下热脱脂效果。结果表明:采用正庚烷为脱脂溶剂时,溶剂脱脂温度越高、脱脂时间越长,溶剂脱脂率越大,在35℃脱脂2.5 h后,脱脂率达到了92.1%,金刚石制品形成了大量的连通孔隙。在600℃保温60 min热脱脂后,金刚石制品中的黏结剂已全部脱除,制品中未发现鼓泡、开裂、塌陷等缺陷,脱脂效果良好。在热脱脂过程中,H2气氛脱脂相对于N2气氛脱脂碳含量增大了0.05%,氧含量减少了0.13%,在H2中脱脂更利于后续烧结过程中金刚石制品的有效烧结。
The injection molding of diamond / copper based solder powder was carried out by powder injection molding technology to prepare small diamond products. Using solvent - thermal degreasing degreasing two-step degreasing diamond products. The effects of degreasing temperature and degreasing time on the degreasing rate were analyzed. The microscopic pore formation under different solvent degreasing time was observed by scanning electron microscopy. The thermal degreasing effects under H2 and N2 were investigated. The results showed that when n-heptane was used as degreasing solvent, the higher the degreasing temperature, the longer the degreasing time, the greater the degreasing rate of solvent, the degreasing rate reached 92.1% after defatted at 35 ℃ for 2.5 h, and the diamond products formed a large amount of Connected to the pores. After heat-degreasing at 600 ℃ for 60 min, the binder in diamond products has been completely removed, and no defects such as bubbling, cracking and collapse are found in the product, and the degreasing effect is good. In the process of thermal degreasing, the degreasing carbon content in H2 degreasing is increased by 0.05% and the oxygen content is reduced by 0.13% in N2 degreasing, and the degreasing in H2 is more effective in sintering of diamond products in subsequent sintering.