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选取平均粒度分别为50nm、7μm,纯度为99.9%的钨粉,采用松装熔渗法制备高强高导铜钨合金,研究其显微组织和相关性能。结果表明,采用松装熔渗法可以制备高强高导铜钨合金,钨粉越细则其烧结性能越好,其致密度高,硬度和强度也较高,但是粉末粒度达到纳米级时,铜相会产生一定程度的偏聚,影响合金组织的均匀性。松装钨粉的孔隙率随着粉体平均粒径的减小而增大。7μm钨粉所制合金抗拉强度为370MPa,电导率为43.34μΩ-1·m-1,硬度HB为80.4,含铜量为65%;50nm的钨粉所制合金抗拉强度为410MPa,电导率为37.07μΩ-1·m-1,硬度HB为112,含铜量为73%。
Tungsten powder with the average particle size of 50nm, 7μm and purity of 99.9% were selected. The high-strength and high-conductivity copper-tungsten alloy was prepared by loose infiltration method, and its microstructure and properties were studied. The results show that the loosely infiltrated method can be used to prepare high strength and high conductivity copper alloy. The thinner the tungsten powder is, the better the sintering property is. The higher the density is, the higher the hardness and the strength are. However, when the particle size reaches nanometer level, Will have a certain degree of segregation, affecting the uniformity of the alloy. The porosity of loose tungsten powder increases as the average particle size of the powder decreases. The tensile strength of 7μm tungsten powder alloy was 370MPa, the conductivity was 43.34μΩ-1 · m-1, the hardness HB was 80.4, the content of copper was 65%, the tensile strength of the alloy prepared by 50nm tungsten powder was 410MPa, The rate was 37.07 μΩ-1 · m-1, the hardness HB was 112, and the copper content was 73%.