在设备厂商的大力合作下，台湾一家半导体公司在2003年5月完成了一条30omm国片焊料凸点 加工线及整体工艺，并于2003年9月得到了用户的首次认可，其工艺和设备介绍如下。 ·UBM城射:采用Nexx的Nimbus 364喊射系统，戏射焊料西点下金属(钦)。 ·匀胶:采用SUSS MieroTe。的ACS 30 In the strong cooperation of equipment manufacturers, a semiconductor company in Taiwan in May 2003 completed a 30omm State film solder bump processing line and the overall process, and in September 2003 for the first time the user’s approval, the process and equipment introduced as follows. · UBM City shot: Nexx’s Nimbus 364 shouting system, show off the solder under the metal point (Chin). Sizing: SUSS MieroTe. ACS 30