把发射或者接收光信号的有源光子器件与无源波导器件(如分支器、耦合器、滤波器及光开关等)集成在单块半导体衬底上称为光集成(PIC);把发射或者接收光信号的有源光子器件与处理电信号和控制光子器件的电子电路制作在单块半导体衬底上称为光电子集成(OEIC)。目前研制的光集成不包含电子器件和电子电路,所以又称全光集成。而光电集成也不包含无源波导及光互连问题,即目前只侧重于光发射端机和光接收端机的集成。但从发展来看,它们将互相结合,应能将各类有源光子器件(激光器、发光二极管和探测器等)、光子控制器件(调制器、光开关等)、光子无源器件(光波导、耦合器、滤波器等)以及处理电信号(存储、放大、复用等)、控制光子器件的电子电路(驱动器、调制器等)制造在同一半导体衬底上,成为理想的光子电子集成电路。随着 The integration of active photonic devices emitting and receiving optical signals with passive waveguide devices such as splitters, couplers, filters and optical switches on a single semiconductor substrate is referred to as optical integration (PIC) Active photonic devices that receive optical signals, and electronic circuits that process electrical signals and control photonic devices, are fabricated as a single optoelectronic integrated circuit (OEIC) on a single semiconductor substrate. The current development of optical integration does not include electronic devices and electronic circuits, so also known as all-optical integration. The optoelectronic integration also does not contain passive waveguides and optical interconnection problems, that is currently focused only on the optical transmitter and receiver optical receiver integration. However, from the viewpoint of development, they will combine with each other and should be able to integrate all kinds of active photonic devices (lasers, light emitting diodes and detectors, etc.), photon control devices (modulators, optical switches and the like), photonic passive devices , Couplers, filters, etc.) as well as processing electrical signals (storing, amplifying, multiplexing, etc.), electronic circuits (drivers, modulators, etc.) that control the photonic devices are fabricated on the same semiconductor substrate and become the ideal photonic electronic integrated circuit . along with