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在国家集成电路产业政策的大力推动下,在业界全体同仁的努力拼搏下,2016年国内半导体封测产业在规模、技术、市场和创新等方面取得了亮丽的成绩。2016年中国封测市场销售达到1523.2亿元,同比增长约14.70%,国内已有长电科技、通富微电、华天科技三家企业进入全球前十强,而长电科技更是以28.99亿美元跻身全球三甲。国内领先企业通过自主研发和兼并收购,在先进封装领域取得突破性进展,技术能力基本与国际先进水平接轨,先进封装的产业化能力也已基本形成。先进封装技术获得突破,Si P系统级封装,目前集成度
With the hard work of the national IC industry policy and the hard work of all my colleagues in the industry, the semiconductor IC packaging and testing industry in China achieved remarkable achievements in terms of scale, technology, market and innovation in 2016. In 2016, IC packaging and testing market in China reached 152.32 billion yuan, an increase of about 14.70% over the same period of previous year. There are three major domestic enterprises, Changjiang Microelectronics and Huatian Technology, which have entered the top 10 in the world, US dollar among the top three in the world. Leading domestic enterprises have achieved breakthroughs in advanced packaging through independent research and development and mergers and acquisitions. Their technological capabilities have basically reached the international advanced level, and the industrialization capabilities of advanced packaging have also been basically established. Breakthrough in Advanced Packaging Technology, Si P System-in-Package, Current Integration