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The effects of cure temperature history on the stability of hinged structure poly(4,4-oxydiphenylene pyromellitimide)(PMDA-ODA) polyimide were studied by dynamic mechanical analysis.The polyimide films were cured under different curing conditions and peeled off by substrate etching.It was found that a proper cure time and temperature ramp rate improves the stability in terms of higher glass transition temperature.Ninety minutes at 375℃or 200℃is a beneficial high glass transition temperature.The temperature ramp rate should be between 2℃/min and 10℃/min,which is neither too high nor too low.