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信号完整性在某种程度上已经成为了限制当前高速电子系统设计与发展的瓶颈。建立了由过孔、焊点、印制线构成的高速电路板复杂互连结构单元模型,在1~10 GHz频率范围内针对模型进行信号传输性能的研究。用高频结构仿真器(HFSS)针对不连续区域内印制线不同长度、焊盘不同半径进行仿真分析,总结这些参数对信号传输性能的影响,提出了复杂互连结构的等效电路模型,并提取参数值进行对比验证。结果表明,随着印制线长度的增加、焊盘半径的增加,信号传输的回波损耗(RL)越来越强。用先进设计系统(ADS)软件对等效电路进行模拟,其回波损耗在1~6 GHz频率范围内与HFSS仿真结果相差不超过1 d B,在6~10 GHz频率范围内相差不超过2 d B。
To some extent, signal integrity has become a bottleneck that limits the design and development of today’s high-speed electronic systems. A high-speed circuit board complex interconnection unit model composed of vias, solder joints and printed wires was established, and the signal transmission performance of the model was studied in the frequency range of 1 ~ 10 GHz. The high frequency structure simulator (HFSS) is used to simulate the different lengths and different radii of pads in the discontinuous area. The influence of these parameters on signal transmission performance is summarized, and the equivalent circuit model of complex interconnection structure is proposed. And extract the parameter values for comparison and verification. The results show that with the increase of the length of the printed wire, the increase of the pad radius increases the return loss (RL) of the signal transmission. Equivalent circuits were simulated using advanced design system (ADS) software with return loss less than 1 dB from HFSS simulation in the 1 to 6 GHz frequency range and no more than 2 dB in the 6 to 10 GHz frequency range d B.