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利用直流电沉积技术系统分析电流密度和镀液糖精浓度对纳米晶体镍性能的影响。结果表明,电流密度在0.5~1.5 A/dm~2时,可调节糖精浓度制备出显微硬度HV分布为415~603 MPa的纳米晶镀层。小电流密度0.5 A/dm~2时,随糖精浓度增大,镀层(200)面衍射强度增强,结构由(111),(200)双织构向(200)面转变,且镀层内应力降低,糖精浓度增大到1.2 g/L时,内应力降为0。镀层晶粒尺寸为28~98 nm时,直到600℃晶粒才开始长大,结构稳定性较好;晶粒尺寸为10 nm时,晶粒在317℃异常长大,其结构稳定性显著下降。
The effects of current density and concentration of plating solution on nickel nanocrystals were systematically analyzed by DC deposition technique. The results show that the nanocrystalline coatings with HV HV distribution of 415 ~ 603 MPa can be prepared by adjusting the concentration of saccharin when the current density is 0.5 ~ 1.5 A / dm ~ 2. When the current density is 0.5 A / dm ~ 2, the diffraction intensity of (200) surface increases with the increase of saccharin concentration, and the structure changes from (111) to (200) , The internal stress decreased to 0 when the saccharin concentration increased to 1.2 g / L. When the grain size of the coating is 28 ~ 98 nm, the grains begin to grow up until 600 ℃, and the structure stability is good. At the grain size of 10 nm, the grains grow abnormally at 317 ℃, and their structural stability declines significantly .