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利用等离子喷涂技术在Cu基体表面制备Ag-SnO_2和Ag-(SnFe)O_2两种涂层材料,测试两种涂层的硬度、电阻率等物理性能,并对涂层样品进行电性能试验,测量涂层的电弧烧蚀速率,进一步通过扫描电镜对涂层样品电弧烧蚀前后的形貌进行观察和分析。结果表明,与无掺杂的Ag-SnO_2涂层相比,Ag-(SnFe)O_2涂层组织更加均匀致密,电弧寿命长而电弧截流值低,电弧烧蚀速率低,涂层表面发生的局部熔化和液态Ag集中喷溅的现象明显减轻。
Two kinds of coating materials, Ag-SnO 2 and Ag- (SnFe) O 2, were prepared on the surface of Cu matrix by plasma spraying. The hardness and electrical resistivity of the two coatings were tested. The electrical properties of the coatings were tested. The arc ablation rate of the coating was observed and analyzed by scanning electron microscopy (SEM). The results show that compared with undoped Ag-SnO 2 coating, the microstructure of Ag- (SnFe) O 2 coating is more uniform and compact, the arc life is longer, the arc cutoff value is low, the arc ablation rate is low, and the local Melting and liquid Ag concentrated splash phenomenon significantly reduced.