Yield stress development of cement paste is potentially governed by percolation of 3-dimensional links formed by hydration products on the surface of the particles. It rises steadily at a gradual rate before a sudden increase in rate of growth. In this study, a method was proposed to predict the yield stress development based on the diameter of spread (D) of mini slump cone test and gradient from electrical resistivity measurement (Km). To evaluate the significance of (D) and (Km) in terms of yield stress, they were quantitatively compared to the initial yield stress (τ0) and rate of yield stress growth (K) obtained from a rheometer. A mathematical relationship between the yield stress of cement paste, diameter of spread and electrical resistivity characteristic gradient was developed. The equation developed can be used as an alternative method to estimate yield stress of cement paste.