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为提高Cu-(Ti3SiC2)p复合材料中铜与陶瓷的界面结合强度,以环境友好型抗坏血酸为还原剂,D-葡萄糖酸钠为络合剂,制备了Cu-Ti3SiC2包覆粉末.研究了Ti3SiC2粉末表面化学镀铜及其电化学性能,以及十二烷基硫酸钠(SDS)结合聚山梨酯80(Tween-80)表面活性剂对化学镀铜的改性效果.采用线性扫描伏安法和开路电位-时间法确定了该体系的电化学机理并进行参数优化.结果表明,提高反应温度,增加Cu(Ⅱ)和抗坏血酸的浓度,可以提高极化电流密度,有利于加速化学镀.铜镀层新核从依附在(Ti3SiC2)p粒子表面的银催化活化中心开始形成,表面具有较多Ag催化活性中心的微球会促进涂层的形成.采用复配改性剂SDS(6～22g/L)+Tween-80(8～12 mL/L)对化学镀铜表面涂覆的效果优于单一改性剂.采用SM4(SDS+Tween-80)改性剂达到最佳涂层效果的Cu与Ti3SiC2的总摩尔比为1∶0.54.静电效应和空间位阻效应对铜在(Ti3SiC2)p表面的生长起着至关重要的协同控制作用.“,”To improve the interface bonding strength between copper and ceramics in Cu-(Ti3SiC2)p composites,the Cu-(Ti3SiC2)p coated powders were prepared using environmental friendly ascorbic acid as reducing agent and D-glucose sodium as complexing agent.The electroless copper plating on the surface of Ti3SiC2 powder and its electrochemical characteristics were investigated.The modification effects of lauryl sodium sulfate(SDS)combined with polysorbate 80(Tween-80)surfactants on electroless copper plating were analyzed.Electrochemical mechanism and parameter optimization of this system was predetermined using linear sweep voltammetry and open circuit potential-time method.The results show that the polarization current density can be improved by raising reaction temperature and concentration of Cu(Ⅱ)and ascorbic acid,which may certainly contribute to accelerate the process of electroless plating.New nuclei are developed from the Ag catalytically activated center implanted on the surface of the copper-coating(Ti3SiC2)p particle,and microspheres with more Ag catalytically active centers promote the formation of copper coatings.Modification effect of combined modifiers of SDS(6～22 g/L)and Tween-80(8～12 ml/L)is superior to that of single one.The total mole ratio of Cu to Ti3SiC2 of the best coating sample is 1∶0.54,modified by SM4(SDS and Tween-80 complex)modifier.Electrostatic effect together with steric hindrance effect play a crucial synergistic role in controlling nuclei and growth of copper on(Ti3SiC2)p surface.