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介绍了热障涂层的发展 ,粘结底层和陶瓷层材料的选择机理及制备工艺 ,电子束物理气相沉积 ( EB- PVD)技术代表了未来热障涂层的发展趋势。阐述热障涂层的 3种结构形式 ,提出热障涂层体系存在的一些问题和优化设计方案。
The development of thermal barrier coatings, the selection mechanism and the preparation process of the bond bottom and ceramic layers are introduced. Electron beam physical vapor deposition (EB-PVD) technology represents the development trend of thermal barrier coatings in the future. The three kinds of structures of thermal barrier coating are described, and some problems existing in thermal barrier coating system and the optimal design scheme are proposed.