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对二甲基二烷氧基硅烷的电子轰击质谱进行了研究。断裂方式主要包括以下几种：Ｓｉ－Ｃ键的断裂（脱ＣＨ_３）、Ｓｉ－Ｏ键的断裂（脱ＯＣＨ２Ｒ）、Ｏ－Ｏ键的断裂（~＋ＣＨ_２Ｒ的生成）、Ｃ－Ｃ键的断裂、氢重排脱烯Ｃ_ｎＨ_２ｎ、氢重排脱醛ＲＣＨＯ等。
Electron impact mass spectra of dimethyl dialkoxysilane were investigated. The fracture modes include the following: Si-C bond cleavage (CH 3 removal), Si-O bond cleavage (OCH 2 R), O-O bond cleavage (~ + CH 2 R generation), C-C bond cleavage, Hydrogen rearrangement dehydropene C_nH_2n, hydrogen rearrangement aldehydes RCHO and so on.