论文部分内容阅读
IT—PCB—CCL—CuFoil 产业链的形成 在电积法铜箔生产工艺工业化应用之前,铜箔用轧制方法制造,它主要用于强电流输送、建筑装饰、家居及图案美化、木屋房顶防水等方面。20世纪50年代初,由于印刷电路板(PCB)业的出现,铜箔业(CuFoil)才成为重要的与电子信息产业(IT)相关联的尖端技术工业。1972年美国耶茨箔材公司发明了电积铜箔生产专利以及日本三井等多家铜箔生产商对该技术和设备的发展,标志着世界电解铜箔制造及表面处理技术跨入了新阶段。20世纪后半叶是电子时代,特别是90年代随着信息技术及产品(包括计算
The formation of the IT-PCB-CCL-CuFoil industry chain Before the industrialization of the electrodeposited copper foil production process, the copper foil was produced by the rolling method. It was mainly used for high current transport, architectural decoration, home and pattern beautification, Waterproof and so on. In the early 1950s, due to the advent of the printed circuit board (PCB) industry, the CuFoil became an important cutting-edge technology industry associated with the electronic information industry (IT). In 1972, Yates Foil Company invented the electroplating copper foil production patent and Japan’s Mitsui and many other copper foil manufacturers on the development of the technology and equipment, marking the world’s electrolytic copper foil manufacturing and surface treatment technology into a new stage . The second half of the twentieth century is the electronic age, especially the 90’s with the information technology and products (including computing