为了简化存储器等更多应用的芯片堆叠,传统的芯片粘接剂正逐步被薄膜型的芯片粘接所取代,原因在于芯片堆叠设计难以使用传统的膏状材料。但现在,Self-Filleting材料可能标志着芯片粘接剂再度成为寻求低廉成本以及在不牺牲性能的情况下,最大限度提高现有资本生命周期的公司所选择的材料。对于多数应用来说,Self-Filleting材料的确取得了突破性的进步。 Traditional chip adhesives are gradually being replaced by film-type die attach in order to simplify the stacking of more applications, such as memories, because of the difficulty of using conventional paste materials for the chip stack design. But now, Self-Filleting® materials may signal the chip adhesive’s once again becoming the material of choice for companies looking for low costs and maximizing the existing capital life cycle without sacrificing performance. Self-Filleting® materials have indeed made a breakthrough in many applications.