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通过对不同的z-pin角度、面板厚度、去除泡沫处理的X-Cor夹层结构试样进行平压性能试验和分析比较,得到其破坏模式及不同设计参数对性能的影响。试验结果表明:X-Cor夹层结构中z-pin和泡沫存在协同增强效应;增大z-pin端部约束和减少z-pin的植入角度能提高平压性能;但z-pin角度为0°的夹层结构平压性能对植入角的角偏差缺陷更敏感,缺陷的存在影响承力性能。
The X-Cor sandwich structure specimens with different z-pin angles, panel thickness and foam removal were tested for flattening performance and analyzed. The failure modes and the influence of different design parameters on the performance were obtained. The results show that z-pin and foam have synergistic enhancement effect in X-Cor sandwich structure. Increasing the z-pin end restraint and reducing the z-pin implantation angle can improve the flattening performance. However, the z-pin angle is 0 ° sandwich structure is more sensitive to the angular deviation of the implant angle, and the presence of defects affects the bearing capacity.