Microstructures and properties of Sn-Ag-Cu lead-flee solder alloys containing La

来源 :中国有色金属学会会刊:英文版 | 被引量 : 0次 | 上传用户:goodywq2008
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Trace amounts of La were utilized to improve the melting behaviors,microstructures,tensile properties and microhardness of Sn-3.0Ag-0.5Cu lead-free solder alloy. La has little effect on the melting behavior of Sn-3.0Ag-0.5Cu alloy according to the differe
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